Die Brush & Foam Pad for Wafer-Thin Dies

Die Brush & Foam Pad for Wafer-Thin Dies

Essential accessory for your projects

From: Ellison

When it comes to removing excess paper in all brands of wafer-thin, chemically-etched dies, the Sizzix Die Brush does it easily and ergonomically. With a sleek, ergonomic rubber-grip handle for non-slippage and easy maneuverability, the Die Brush easily rolls away excess paper to reveal the perfect cut! The Die Brush includes a Foam Pad that acts as the perfect work surface for removing excess paper from the dies and even the cutout.
The Die Brush measures approximately 5 1/2" x 1 3/4" x 1 1/4" and the Foam Pad measures approximately 4 1/2" x 7 1/4".

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[ACCSIZZ-660513 #113401]
Other HobbiesScrapbooking
€ 8.71

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